JIANGSU JINGKUN TECHNOLOGY CO., LTD. IS A COMMITMENT TO THE FOURTH GENERATION OF ELECTRONIC PACKAGING MATERIALS- DIAMOND ALUMINUM,DIAMOND COPPER,ALUMINUM GRAPHITE, ALUMINUM BASED SILICON CARBIDE AND OTHER COOLING MATERIALS RESEARCH AND DEVELOPMENT, PRODUCTION, SALES AND SERVICE IN AN INTEGRATED COMPREHENSIVE TECHNOLOGY COMPANY.
RRODUCTS MAINLY INCLUDE:DIAMOND COPPER, DIAMOND ALUMINUM, ALUMINUM-BASED SILICON CARBIDE, COVERING MILITARY INDUSTRY, SEMICONDUCTOR, AUTOMOTIVE AND OTHER INDUSTRIES.

Jiangsu Jingkun is a pioneering leader in high thermal conductivity metal matrix composite (MMC) materials, providing innovative, systematic, and dedicated thermal management solutions to customers worldwide.
Our core product — the Diamond-Metal Composite Heat Spreader — is fabricated through an advanced sintering process combining copper or aluminum matrices with diamond particles. Diamond particles deliver a thermal conductivity of up to 2,200 W/(m·K), over five times that of pure copper, while maintaining an ultra-low coefficient of thermal expansion (CTE) below 1 ppm/K. This unique combination makes it the ultimate material choice for high-power electronic thermal management.
With a metallizable surface and lightweight structure, our diamond-copper and diamond-aluminum composites are engineered for high-power device packaging, IGBT modules, and advanced semiconductor applications — effectively reducing chip junction temperatures and enhancing long-term reliability.