Jinan Xintian Technology Co., Ltd.
- PresidentLI XIAORAN
- Tel86-199-1692-5368
- E-mailinfo02@pe-exhibition.com
- Websitehttp://www.xtcnclaser.com/
- Exhibit fieldLaser processing technology and devices
introduction
The company is committed to the research, development, production and sales of laser industrial equipment such as glass laser cutting machine, glass laser frosting
machine, glass laser punching machine, laser marking machine, laser welding machine, laser cleaning and supporting automation system. It is a professional provider of
customized solutions for laser industrial applications. The sales network covers all provincial capitals and municipalities, and exported to India, Russia, Europe, Southeast Asia
and other more than180 countries and regions.
The company has been focusing on the field of laser industrial applications for many years, and is committed to providing professional laser application system
solutions. Under the strategic planning of specialization,diversification and grouping. the product users cover all provinces in China and have established business relationg
with more than180 countries and regions overseas. The localized sales service at home and abroad is constantly upgraded, with professional quality and service in the laser
industry market to establish a good brand image and reputation.
Major Item introduction
1. Infrared Picosecond Glass Cutting Machine – XTL-PCE6060I
This single-platform system integrates cutting and splitting in one process, boosting efficiency by 40%. The fully enclosed design ensures safe laser radiation isolation, while the sealed optical path prevents dust for long-term accuracy. High-precision CCD visual recognition enables real-time positioning and compensation, improving yield rates. Intelligent features include bus control for stable signal transmission, precision scanning for high-speed continuous cutting, layered cutting for thick glass, and PSO function for uniform spot distribution. Optional pneumatic clamping and dust extraction support thick glass processing and environmental compliance. Ideal for sapphire, optical glass, semiconductor chips, silicon wafers, and 3C electronic covers.
2. Desktop Integrated Laser Marking Machine
Designed for speed and precision, this marker operates at ≤10,000 mm/s with micron-level resolution (12 μRad). Its ultra-long lifespan of 100,000 hours (5–10 years continuous use) and low energy consumption support green production. The robust sheet-metal welded cabinet ensures stability. Available in fiber, CO₂, and UV types, with marking formats from 70–300 mm. Perfect for electronic components, ICs, hardware, precision instruments, and mobile communications.